Powered by Artilux’s proprietary Germanium Silicon (GeSi) photonic platform, our device portfolio embodies a new generation of optoelectronic innovation — where broad-spectrum sensitivity, ultra-high speed, and CMOS scalability converge. These breakthroughs redefine the fundamentals of photon-detection and modulation, bridging scientific precision with industrial scalability.
The Infrared (IR) spectrum is placed between the visible and microwave regions, which spans from 0.75 to 12 micron (μm), and can be classified into 4 sub-bands: Near Infrared (NIR), Short Wave Infrared (SWIR), Mid Wave Infrared (MWIR), and Long Wave Infrared (LWIR).
Halcyon™ — GeSi Photodetector (PD)
A new benchmark in CMOS-compatible photonics. Halcyon™ achieves over 1,000× reduction in dark current, combining ultra-low noise, broad-spectrum sensitivity, and mass production scalability.
Applications: Biosensing, hyperspectral imaging, energy-efficient optical interconnects.
morePhoenix™ — GeSi Avalanche Photodetector (APD)
Designed for extreme sensitivity and low noise, Phoenix™ reduces both primary and avalanche dark currents by orders of magnitude beyond conventional materials. Fully CMOS-compatible, it combines high gain, low noise, and broad-spectrum operation — ideal for next-generation optical interconnects, SWIR sensing, and imaging systems.
Applications: AI data infrastructure, optical interconnect fabrics, and advanced sensing systems.
moreNova™ — GeSi Single-Photon Avalanche Diode (SPAD)
The Artilux GeSi SPAD brings broadband single-photon detection to room temperature, achieving ultra-low dark count rates and high photon detection efficiency (PDE) in a compact array form factor.
Applications: Biosensing, quantum photonics, and 3D imaging.
moreGeSi EAM — high-speed modulation for the photonic age
Ultra high bandwidth, low insertion loss with improved temperature stability, small foor print, operated in the O-band
Artilux’s Ge EAM delivers ultra-high bandwidth, low insertion loss, and enhanced temperature stability within an ultra-compact footprint, operating efficiently in the O-band. Built upon the GeSi photonic platform, it combines the speed and modulation depth of germanium with the scalability of silicon CMOS. This breakthrough aims to enable energy-efficient, high-speed optical links for next-generation AI data centers, chiplet interconnects, and advanced computing architectures — redefining the limits of performance and integration in optical communication.
Applications: Optical interconnect fabrics
moreMetalens — planar metasurface optics
The Artilux Metalens technology reimagines light control at the chip scale. Through subwavelength metasurface engineering, it provides broadband focusing, beam shaping, and aberration-free imaging — all within an ultra-thin, CMOS-compatible structure. Seamlessly integrated with Artilux’s GeSi platform, it enables compact, low-power optical systems for bio-sensing, spectral imaging, and optical interconnect and photonic computing.
Applications: Optical coupling, compact imaging, integrated photonic systems.
moreUnified by the Artilux GeSi platform
Each Artilux product is powered by our GeSi photonic foundation — a convergence of physics, materials science, and semiconductor engineering that transforms light into scalable intelligence. Together, these innovations define the core building blocks for the next generation of photonic and quantum technologies.